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In the grinder, the silicon wafer is ground into a certain thickness and finish with the abrasive liquid prepared by white corundum or emery. There are single-side grinding and double-side grinding two ways.
In order to prepare the silicon wafer surface suitable for the fabrication of devices and integrated circuits, it is necessary to polish the surface to remove the residual damaged layer and obtain a certain thickness of high flatness mirror silicon wafer. Polishing is divided into mechanical polishing, chemical polishing, electron beam polishing, ion beam polishing, chemical mechanical polishing is widely used. Chemical mechanical polishing is chemical corrosion and mechanical grinding at the same time, including copper ion polishing, chromium ion polishing and silica colloidal polishing commonly used. Silica colloidal polishing is a colloidal polishing liquid prepared by very fine silica powder, sodium hydroxide (or organic base) and water. In the polishing process, sodium hydroxide and silicon surface reaction natural sodium silicate, through grinding with silica colloid, sodium silicate into the polishing liquid, the two processes are carried out at the same time without pause to achieve the purpose of polishing. Depending on the requirements, it can be used for primary polishing, secondary polishing (rough polishing and fine polishing) or tertiary polishing (rough polishing, intermediate polishing and fine polishing). In order to meet the requirements of surface quality and smoothness of VlSI, new techniques such as wax-free polishing and abrasion-free polishing have been developed.
A grinder that grinds the surface of a work piece with a grinding tool coated or embedded with abrasives. Mainly used for grinding workpiece high precision plane, inside and outside cylindrical surface, conical surface, spherical surface, thread surface and other shape surface. The main types of grinding machines are disc grinding machines, rotary shaft grinding machines and various special grinding machines.
(1) Disc grinding machine: there are two kinds of single disc and double disc, and the double disc grinding machine is the most common application.
(2) Rotary shaft grinding machine: by the positive and reverse rotation of the main shaft to drive the workpiece or grinding tool (adjustable grinding ring or grinding rod) rotation, simple structure, used for grinding inside and outside the cylinder.
③ Special grinding machine: according to the different grinding workpiece, there are center hole grinding machine, ball grinding machine and gear grinding machine.
In addition, there is a centerless grinding machine using a similar principle of centerless grinding, used for grinding cylindrical workpiece.
The diversified performance of the grinding machine:
1, polishing machine in the vibration grinding polishing process does not damage the original size and shape of the parts.
2. The polishing function is active and convenient to operate. In the process of operation, the processing of parts can be checked at any time.
3. Fonda double-sided grinding machine adopts the world's leading spiral tumbling activity and the principle of ternary oscillation, so that the parts and grinding tools grind each other to achieve polishing effect.
4, Type A polishing machine can take the initiative to separate abrasive and workpiece, complete active material selection, save labor costs.
5, the grinding machine is suitable for large quantities of small, small and scale parts of the grinding and polishing processing, several times of progress, save about one third of the cost.
