NEWS
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Grinding is the action of a medium (superhard abrasive and related paste, or liquid carrier) between the surface of the part and the grinding disc.
When the diamond particles are embedded in the grinding disc, the particles are equivalent to superfinishing grinding, and some particles may be removed from the grinding disc continuously during the grinding process.
As free particles roll between them. The surface of the part thus ground has no directional texture. Grinding polishing machine grinding process that diamond particles cut into the working surface to remove fine material.
Imagine this kneading and rubbing process repeated millions of times on the surface of the part, effectively removing the material and polishing it. (When diamond abrades are as fine as 50nm,
Polishing is more obvious).
To gain the inherent strength advantage of diamond abrasives, the ideal surface grinder needs to have high downward pressure or downward thrust (5psi or higher) with a powerful drive system,
Allows for large pressure loads, variable speeds and the ability to rotate at high speeds.
Compared with traditional grinding using alumina abrasive, diamond superhard abrasive grinding has the following advantages:
High removal rate, to achieve higher production efficiency
◎ Half wavelength (11 millionths of an inch), perfect edge-to-edge flatness, up to 1/20 wavelength flatness in some cases
The surface roughness is better than the sub-micron level (<0.5Ra), some cases can reach the sub-nanometer level
It can realize one step grinding and polishing program, shorten the processing time
◎ Support green by reducing waste
